CAPA13S - AMD Ryzen V1000 Series 3.5" SBC with quad display LVDS/HDMI/DP, up to 4x Gigabit Ethernet, 2x USB3.1, 2x USB2.0 and 2x COM


CE is a mandatory standard for products on the market in the European Economic Area. By CE marking a product, the manufacturer ensures that the item meets the essential safety requirements set out in the applicable CE directive.


This product fully adheres to the Restriction of Hazardous Substances Directive 2002/95/EC, RoHS for short.  The directive covers the restriction of use of certain hazardous substances in electrical and electronic equipment and was adopted in February 2003 by the European Union.


These products use heatsink, heatpipe and extrusion technology to dissipate the heat generated by the system rather than using traditional fans thus improving system reliability and longevity.

Wide Temperature

These products utilise high quality industrial grade components enabling them to work in wide temperature environments. They are capable of running as low as -20C and as high as +70C.

Windows 10

This system can be supplied with Windows 10 configured to your specification, including disk partitioning, driver and software installations, along with Windows feature setup and application-specific configuration.


This system features USB3 ports for fast communication to peripheral devices.


M.2, formerly known as the Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors. M.2 replaces the mSATA standard, which uses the PCI Express Mini Card physical card layout and connectors. Employing a more flexible physical specification, the M.2 allows different module widths and lengths, and, paired with the availability of more advanced interfacing features, makes the M.2 more suitable than mSATA in general for solid-state storage applications


Trusted Platform Module (TPM) is an international standard for a secure cryptoprocessor, a dedicated microcontroller designed to secure hardware through integrated cryptographic keys.

CAPA13S Ryzen Embedded SBC
CAPA13S baseCAPA13S cooler

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CAPA13S with AMD RYZEN V1605B (2.0 - 3.6 GHz) 15W processor, 2x GbE, audio and fan


CAPA13S with AMD RYZEN V1605B (2.0 - 3.6 GHz) 15W processor, 4x GbE, audio and fan


CAPA13S with AMD RYZEN V1807B (3.35 - 3.8 GHz) 45W processor, 2x GbE, audio and fan


CAPA13S with AMD RYZEN V1807B (3.35 - 3.8 GHz) 45W processor, 4x GbE, audio and fan

* Lead time is indicative and is subject to change at time of ordering. Next business day delivery on in-stock products only (when ordered before 3pm).
** Contact us for quantity or project pricing.
† Additional delivery charge may be incurred for certain postcodes (calculated at checkout)

CAPA13S overview


Impulse can supply the CAPA13S embedded board fully configured and tested in our UK engineering facility with your choice of memory, storage and O/S. We can also design and assemble a complete system solution using the CAPA13S board along with a chassis and components to your exact specification.

For more information about the CAPA13S Ryzen embedded SBC please contact our technical sales team on +44 (0)1782 337 800 or alternatively submit an enquiry.

  • Embedded SBC
  • Onboard AMD Ryzen V1605B/V1807B with VEGA Graphics
  • Supports up to 16GB of 1x DDR4-2400 (V1605B), DDR4-3200 (V1807B) SO-DIMM
  • 2x HDMI ports, 1x eDP and 1x DP port
  • 2x Gigabit Ethernet (RJ45)
  • 1x SATAIII 1 x M.2 Key B storage options 
  • 2x USB 2.0 ports and 2x USB 3.2 Gen2 ports
  • 1x RS-232 and 1x RS-232/422/485
  • 8-channel programmable I/O
  • Mic-in/Line-in/Line-out 
  • 1x M.2 Key E expansion slot
  • TPM 2.0 compliant
  • Optional heat spreader
  • Single 12V DC power input
  • Wide -20°C to +60°C operating temperature
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